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Year : 2019  |  Volume : 11  |  Issue : 6  |  Page : 221-227

Evaluation of resin penetration depth in enamel surface for orthodontic bonding exposed to five types of enamel conditioning methods: A scanning electron microscopic study

1 Department of Orthodontics, Vivekanandha Dental College for Women, Tiruchengode, Tamil Nadu, India
2 Private Practitioner, Erode, Tamil Nadu, India
3 Department of Orthodontics, KSR Institute of Dental Science and Research, Tiruchengode, Tamil Nadu, India

Correspondence Address:
Dr. D Pawan Kumar Bhandari
Department of Orthodontics, Vivekanandha Dental College for Women, Tiruchengode 637205, Tamil Nadu
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Source of Support: None, Conflict of Interest: None

DOI: 10.4103/JPBS.JPBS_301_18

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Aims and Objectives: To evaluate the enamel surface depth of resin penetration for orthodontic bonding when exposed to five types of enamel conditioning methods using scanning electron microscope. Materials and Methods: The sample comprised of 25 human extracted premolar teeth for orthodontic reasons. The samples are divided into 5 groups with each 5 teeth based on the enamel conditioning methods such as group A with 37% Phosphoric acid, group B with 10% Polyacrylic acid, group C with Self etch primer, group D with Laser etching and group E with air abrasion etching. All the samples in each group are bonded with metal brackets using Transbond XT Adhesive. After bonding, the teeth are sectioned mesiodistally using hard-tissue microtome and observed under scanning electron microscope at 500x and 3000x for the calculation of depth of resin penetration. Results: The teeth etched with 37%phosphoric acid exhibited significantly greater depth of resin penetration (15.1µm) than do self-etch and polyacrylic acid. Laser etching has comparable penetration depth with that of acid etching. Air abrasion has got the least penetration of all groups. Conclusion: Comparing the enamel treated with these conditioning methods, the penetration of resin material into enamel are greater when it is treated with 37% Phosphoric acid than self-etch or laser etching.

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